Q2100A series automatic wire bonders –
point, click, bond

Model Q2119A Gold Ball Bonder / Model Q2170A Wedge Bonder

Filling a growing need for affordable high performance equipment in the multi-chip, sensor, opto-electronic and specialty component wire bonding industry, these fine pitch automatic wire bonders simplify set-up and drastically reduce changeover time. To find out how user-friendly the Q2100A series is, or for complete information on all Questar products, contact Questar.

• Fully automatic, fine pitch wire bonders capable of bonding 17-75 micron diameter wire.
• Convenient, rapid changeover design allows package conversions in as
  little as 3 minutes and accommodates a multitude of device configurations.
• Simplified menu driven software is easy to program and provides
  convenient access to all machine functions.
• Programmable USG with new transducers, high-frequency USG and
  programmable temperature controllers are available.
  
  *Workholders ordered separately.   View Q2119A Specs    View Q2170A Specs 

View Q2119A wire bonder product video

View brief user-friendly 2170A product video in automatic mode

View brief user-friendly 2170A product video in semi-automatic mode

Q2100E series economical automatic wire bonders

Model Q2119E Gold Ball Bonder / Model Q2170E Wedge Bonder

The soon to be introduced Q2100E series automatic wire bonders provide an economical alternative to the Q2100A series. Contact us to determine whether the Q2100E series may be right for your application.

Learn how Questar can help you meet your wire bonding needs